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Dr Todd Green

Knowledge Exchange Associate

Chemical and Process Engineering

Personal statement

Initially I studied at the University of Western Australia and obtained a BSc(Hon) and PhD in Physical Chemistry. I was then a post-doctoral researcher in electrochemistry at Aarhus University in Denmark (1995) and electrochemical engineering at the University of Newcastle in the UK (1996 - 1998). Subsequently I worked (1999 - 2015) as a Process Engineer for a number of UK companies involved in the microfabrication of optoelectronic, semiconductor and microsystem devices. 

In 2015 I moved to the University of Strathclyde where I am currently a Knowledge Exchange Associate in the Department of Chemical and Process Engineering. I am a member of Institute of Engineering and Technology (IET) and NACE International.

Expertise

Has expertise in:

    • Electrochemistry and electrochemical engineering

    • Electrodeposition of metals and alloys

    • Corrosion

    • Modelling of electrochemical systems

    • Materials characterisation

    • Nanotechnology

    • Microfabrication, MEMs, sensor development

Publications

Copper electrodeposition from a water-containing choline chloride based deep eutectic solvent
Valverde Priscila, Green Todd, Roy Sudipta
ECS Transactions Vol 77, pp. 859-864, (2017)
http://dx.doi.org/10.1149/07711.0859ecst
Pulse plating of copper from deep eutectic solvents
Green Todd, Su Xiaomeng, Roy Sudipta
ECS Transactions Vol 77, pp. 1247-1253, (2017)
http://dx.doi.org/10.1149/07711.1247ecst
Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
Valverde Armas Priscila Estefania, Roy Sudipta, Green Todd
ChemEngUKDay 2017, pp. 172, (2017)
Application of a duplex diffusion layer model to pulse reverse plating
Green T.A., Roy S.
Transactions of the Institute of Metal Finishing Vol 95, pp. 46-51, (2017)
http://dx.doi.org/10.1080/00202967.2016.1214354
Electrochemical copper recovery from galvanic sludge
Huyen Pham T., Dang T.D., Tung Mai T., Huyen Nguyen T.T., Green T.A., Roy S.
Hydrometallurgy Vol 164, pp. 295-303, (2016)
http://dx.doi.org/10.1016/j.hydromet.2016.06.028
Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method
Serrà Albert , Coleman Simon J., Gómez Elvira, Green T.A., Vallés Elisa, Vilana Joan, Roy Sudipta
Electrochimica Acta Vol 207, pp. 207-217, (2016)
http://dx.doi.org/10.1016/j.electacta.2016.04.003

more publications

Address

Chemical and Process Engineering
James Weir Building

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