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Dr Todd Green

Knowledge Exchange Associate

Chemical and Process Engineering

Personal statement

Initially I studied at the University of Western Australia and obtained a BSc(Hon) and PhD in Physical Chemistry. I was then a post-doctoral researcher in electrochemistry at Aarhus University in Denmark (1995) and electrochemical engineering at the University of Newcastle in the UK (1996 - 1998). Subsequently I worked (1999 - 2015) as a Process Engineer for a number of UK companies involved in the microfabrication of optoelectronic, semiconductor and microsystem devices. 

In 2015 I moved to the University of Strathclyde where I am currently a Knowledge Exchange Associate in the Department of Chemical and Process Engineering. My main activities and interests are in the area of corrosion prevention - espcially the development of corrosion inhibitors for harsh environments and investigations of corrosion under insulation (CUI). I am a member of Institute of Engineering and Technology (IET) and NACE International.

Expertise

Has expertise in:

    • Corrosion science and engineering
    • Electrochemistry and electrochemical engineering

    • Electrodeposition of metals and alloys

    • Materials characterisation

    • Microfabrication, MEMs, sensor development

Publications

Anodic reactions and the corrosion of copper in deep eutectic solvents
Green T. A., Valverde P., Roy S.
Journal of the Electrochemical Society Vol 165, pp. D313-D320, (2018)
http://dx.doi.org/10.1149/2.0371809jes
Electrodeposition of Cu from a water-containing deep eutectic solvent
Valverde Armas Priscila Estefania, Roy Sudipta, Green Todd
22nd Topical meeting of the International Society of Electrochemistry (ISE) 2018, (2018)
Effect of water on Cu electrodeposition from a water-containing deep eutectic solvent
Valverde Armas Priscila Estefania, Roy Sudipta, Green Todd
Royal Society of Chemistry Twitter Poster Conference, (2018)
Copper electrodeposition from a water-containing choline chloride based deep eutectic solvent
Valverde Priscila, Green Todd, Roy Sudipta
ECS Transactions Vol 77, pp. 859-864, (2017)
http://dx.doi.org/10.1149/07711.0859ecst
Pulse plating of copper from deep eutectic solvents
Green Todd, Su Xiaomeng, Roy Sudipta
ECS Transactions Vol 77, pp. 1247-1253, (2017)
http://dx.doi.org/10.1149/07711.1247ecst
Effect of water on Cu electrodeposition from ethaline based deep eutectic solvent
Valverde Priscila, Roy Sudipta, Green Todd
ChemEngUKDay 2017, pp. 172, (2017)

more publications

Address

Chemical and Process Engineering
James Weir Building

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