Dr Todd Green

Knowledge Exchange Associate

Chemical and Process Engineering

Personal statement

Initially I studied at the University of Western Australia and obtained a BSc(Hon) and PhD in Physical Chemistry. I was then a post-doctoral researcher in electrochemistry at Aarhus University in Denmark (1995) and electrochemical engineering at the University of Newcastle in the UK (1996 - 1998). Subsequently I worked (1999 - 2015) as a Process Engineer for a number of UK companies involved in the microfabrication of optoelectronic, semiconductor and microsystem devices. 

In 2015 I moved to the University of Strathclyde where I am currently a Knowledge Exchange Associate in the Department of Chemical and Process Engineering. My main activities and interests are in the area of corrosion prevention - espcially the development of corrosion inhibitors for harsh environments and investigations of corrosion under insulation (CUI). I am a member of Institute of Engineering and Technology (IET) and NACE International.

Expertise

Has expertise in:

    • Corrosion science and engineering
    • Electrochemistry and electrochemical engineering

    • Electrodeposition of metals and alloys

    • Materials characterisation

    • Microfabrication, MEMs, sensor development

Qualifications

  • BSc Hons (1st Class) in Physical and Inorganic Chemistry, University of Western Australia, Perth, Australia. 

  • PhD in Physical Chemistry, University of Western Australia, Perth, Australia. 

  • Member of The Institution of Engineering and Technology (MIET)

  • Member of NACE International

Publications

Investigation of water absorption profile of mineral wool insulation
Edet John, Green Todd, Roy Sudipta
Electrochem 2019 (2019)
Fibre-optic pH sensor based on silver nanoparticles for Harsh Environments
Debnath Shaon, Roy Sudipta, Green Todd, Chen Yi-Chieh
Electrochem 2019 (2019)
Anodic reactions and the corrosion of copper in deep eutectic solvents
Green T A, Valverde P, Roy S
Journal of the Electrochemical Society Vol 165, pp. D313-D320 (2018)
https://doi.org/10.1149/2.0371809jes
Electrodeposition of Cu from a water-containing deep eutectic solvent
Valverde Armas Priscila Estefania, Roy Sudipta, Green Todd
22nd Topical meeting of the International Society of Electrochemistry (ISE) 2018 (2018)
Effect of water on Cu electrodeposition from a water-containing deep eutectic solvent
Valverde Armas Priscila Estefania, Roy Sudipta, Green Todd
Royal Society of Chemistry Twitter Poster Conference (2018)
Pulse plating of copper from deep eutectic solvents
Green Todd, Su Xiaomeng, Roy Sudipta
ECS Transactions Vol 77, pp. 1247-1253 (2017)
https://doi.org/10.1149/07711.1247ecst

more publications

Professional activities

Electrochem 2019
Organiser
26/8/2019
Electrodeposition of Tin from Deep Eutectic Solvents Using Pulse Current
Contributor
16/9/2018
Short Course in Corrosion Prevention in the Chemical and Petrochemical Industries
Invited speaker
5/6/2018
Cu Electrodeposition from Deep Eutectic Solvents using Pulse Current
Contributor
31/5/2018
22nd Topical meeting of the International Society of Electrochemistry (ISE)
Contributor
15/4/2018
National Physical Laboratory (NPL) (External organisation)
Member
22/11/2017

more professional activities

Projects

OGIC Downhole Energy
Berlouis, Leonard (Principal Investigator) Cussen, Eddie (Principal Investigator) Green, Todd (Co-investigator) Robertson, Stuart (Co-investigator) Roy, Sudipta (Co-investigator)
08-Jan-2018 - 07-Jan-2019

more projects

Address

Chemical and Process Engineering
James Weir Building

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