Strathclyde researchers integrate optical devices made of multiple materials onto single chip
High-accuracy integration of photonic devices from multiple-materials in close proximity offers unique possibilities of fabricating chip-based systems of more compact designs using optical devices. A collaboration project between the University of Strathclyde, the University of Glasgow and the Australian National University, led by Michael Strain (Institute of Photonics, the University of Strathclyde) developed an enabling method to position devices of multiple materials in close proximity on host surfaces and systems, published in the Special Issue on Hybrid Integrated Photonic Platforms in Optical Materials Express.
The reported method, based on the concepts of reversible adhesion, allows the pick-and-place integration of micron scale devices with high densities and without disturbing already integrated devices. This provides unique opportunities for creating systems with reduced separations on single chip. The technology is not limited to optical devices and can be useful for electronics specialists. Their work was also highlighted by Optica (former OSA) in a news release.