Semiconductor manufacturing requires ever-increasing inspection speeds and resolution as device complexity grows. Current automated optical inspection (AOI) systems often rely on high-magnification, high numerical aperture objectives to achieve the necessary defect detection performance, however, this imposes limits on field of view (FOV) and therefore limits throughput. At the same time, the industry is transitioning from traditional bulb-based illumination to advanced LED technologies including short-wavelength infrared (SWIR) sources driven by demands for improved stability, controllability, energy efficiency, and reliability.

This project will investigate the use of Fourier Ptychographic Microscopy (FPM) as a computational imaging method to enable high-resolution, large-FOV imaging using lower-magnification objectives. By synthetically increasing the effective numerical aperture, FPM offers the potential to significantly increase inspection speed without sacrificing the resolution required for critical defect detection. Both transmission-mode SWIR FPM and visible-range reflective FPM will be explored, making use of emerging high-brightness LED sources in these spectral regions.

The research aims to evaluate the performance trade-offs, practical implementation considerations, and industrial viability of FPM for semiconductor inspection. The outcomes will guide the potential development of new illumination products and imaging approaches within the sponsor company. This project will provide an industry-relevant doctoral training opportunity at the intersection of photonics, computational imaging, and semiconductor metrology.

Semiconductor manufacturing requires ever-increasing inspection speeds and resolution as device complexity grows. Current automated optical inspection (AOI) systems often rely on high-magnification, high numerical aperture objectives to achieve the necessary defect detection performance, however, this imposes limits on field of view (FOV) and therefore limits throughput. At the same time, the industry is transitioning from traditional bulb-based illumination to advanced LED technologies including short-wavelength infrared (SWIR) sources driven by demands for improved stability, controllability, energy efficiency, and reliability.

This project will investigate the use of Fourier Ptychographic Microscopy (FPM) as a computational imaging method to enable high-resolution, large-FOV imaging using lower-magnification objectives. By synthetically increasing the effective numerical aperture, FPM offers the potential to significantly increase inspection speed without sacrificing the resolution required for critical defect detection. Both transmission-mode SWIR FPM and visible-range reflective FPM will be explored, making use of emerging high-brightness LED sources in these spectral regions.

The research aims to evaluate the performance trade-offs, practical implementation considerations, and industrial viability of FPM for semiconductor inspection. The outcomes will guide the potential development of new illumination products and imaging approaches within the sponsor company. This project will provide an industry-relevant doctoral training opportunity at the intersection of photonics, computational imaging, and semiconductor metrology.